Thermalright peerless assassin 120 black cpu air coolers in comparison

Better cooling With Full electroplating reflow welding process, the main body of the twin towers is sprayed with black paint at the nanoscale, the effective heat dissipation area is 9600cm. The offset asymmetric layout is allowed to installation on first graphics card slot, so that the cooler master can achieve excellent heat dissipation performance during work.

Better cooling With Full electroplating reflow welding process, the main body of the twin towers is sprayed with black paint at the nanoscale, the effective heat dissipation area is 9600cm. The offset asymmetric layout is allowed to installation on first graphics card slot, so that the cooler master can achieve excellent heat dissipation performance during work.

Magnetic digital scoreboard The ARGB digital display board on the magnetic top cover can capture the temperature and occupancy information of the CPU and graphics card. In combination with the TRCC control software, the colour switching of the temperature numbers can be realized

AGHP technology 6 6 mm heat pipes use the AGHP technology. Solve the reverse gravity effect caused by vertical horizontal alignment, CPU cooler TDP is 120 to 265 W. 6 sintered pure copper heat pipes & PWM fan & pure copper base & reflow welding process with full electroplating

Thermalright Peerless Assassin 120 SE V2(PA120 SE V2)

Brand Overview Thermalright is a Taiwan brand with more than 20 years of development. It has a certain popularity in the domestic and foreign markets and has a pivotal influence in the player market. We have been focusing on the research and development of computer accessories. R & D product lines include CPU air-cooled radiator, case fan, thermal silicone pad, thermal silicone grease, CPU fan controller, anti falling off mounting bracket, support mounting bracket and other commodities

Better cooling With Full electroplating reflow welding process, the main body of the twin towers is sprayed with white paint at the nanoscale, the effective heat dissipation area is 9600cm . The offset asymmetric layout is allowed to installation on first graphics card slot, leave room for memory-chip, so that installation of the cooler is unrestricted, so that the CPU cooler can achieve excellent heat dissipation performance during work.

Brand Overview Thermalright is a Taiwan brand with more than 20 years of development. It has a certain popularity in the domestic and foreign markets and has a pivotal influence in the player market. We have been focusing on the research and development of computer accessories. R & D product lines include CPU air-cooled radiator, case fan, thermal silicone pad, thermal silicone grease, CPU fan controller, anti falling off mounting bracket, support mounting bracket and other commodities

Brand Overview Thermalright is a Taiwanese brand with more than 20 years of development history. It has a certain degree of popularity in the domestic and international markets, and has a decisive influence in the cooler market. We have been focusing on the research and development of computer accessories. The R&D product line includes CPU coolers, CPU water cooling coolers, case fans, thermally conductive silicone grease, accessories and other products.

Product Specifications Size L120 mm x W48 mm x H154 mm(4.72 x 1.89 x 6.06 inches); Cooler Material Aluminium. All-aluminium fins in the main body bring the maximum heat dissipation area.

Product Specifications Model PA140 Black; CPU cooler size 140 (L) x 157 (W) x 158 (H) mm (5.51 x 6.18 x 6.22 inches); Heatsink material Aluminium, CPU cooler is equipped with all-metal fasteners with SS2 buckle system, multiple specifications adapted to be compatible with a wide range of CPU model coolers, easier to install, dual tower dual Dual tower and dual fans for more powerful cooling.

Better cooling Adopting black paint fully electroplated reflow soldering process, the top adopts blackened nano coating+fully electroplated heat pipe+fine micro carved copper bottom, greatly increasing the effective heat dissipation area. memory cut corner avoidance design and can achieve excellent heat dissipation performance during operation.