MoneyQiu HY-510-25g Thermal Conductivity: >1.93W/m-k thermal heatsink paste grease Compound Carbon Based High Performance non-conductive for pc cpu gpu 25 Gram
EXCELLENT THERMAL CONDUCTIVITY Thermal Paste conductivity 1.93 W m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
10 x HY410 White 0.5g Slim Tube Thermal Grease Paste 0.925 W/m-k for LED CPU etc
Halnziye
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Chivs86 PC Cooling Halnziye HY410 30g White Thermal Grease Paste for CPU Heatsink
5 W m-K ensures efficient heat transfer from CPU to heat sink.
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Corsair XTM60 High Performance Thermal Paste for CPU or GPU, 3g - Low Viscosity, Long-Term Stability, Easy Application, Included Applicator Card
Superior Cooling Performance Provides exceptional thermal conductivity between your CPU or GPU and cooler, resulting in improved heat dissipation and significantly lower temperatures than comparable alternatives ideal for enthusiasts who demand uncompromising cooling efficiency for overclocking or high-performance gaming.
Cooler Master CryoFuze Premium Performance Thermal Paste, Nanoparticles, | 2 Grams | Thermal Compound (for GPU, CPU, Consoles, Laptops Graphics Cards, Heat Sinks)
Non Corrosive Formula Non corrosive and oxidation resistant properties leave metal surfaces unharmed and does not solidify.
Thermal Paste,Thermal Conductive Glue,High Performance Heat Sink Compound,Heatsink Thermal Paste,Long-Life Thermal Grease,for Cpu,Gpu,Memory,Electronic Equipment and Other Heat Dissipation Components
Efficient Heat Dissipation This thermal paste is designed to meet the requirements of electronic equipment and other heat dissipation components.Using thermal conductive glue based on advanced thermal conduction technology,high performance heat sink compound ensures that your CPU can maintain the optimal temperature even under heavy load,thereby extending the life of the device and improving performance while using heatsink thermal paste
HEATSINK PASTE for Transistors, Diodes, CPU`s etc. - White - 25 g compound injection type
Product description Fixapart WPS 25GRAM flat-screen mount
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Tianhaixing Thermal Grease (30 Grams) HY880> 5.15 W/m.k, Excellent Thermal Compound Paste with Carbon Based High Conductivity, Thermal Paste for all CPU Coolers/Printer/Heatsink/Other Devices
Performance Parameters Heat Conductivity 5.15 W m-K; Thermal impedance
Heat Sink Thermal Paste - Carbon Based High Performance CPU Thermal Paste for All processors (CPU, GPU, PC) - CPU Paste with Ultra-Efficient Heat Dissipation with Zero Electrical Conductivity
This thermal paste CPU is so simple to apply that even amateurs can do it. The precisely designed syringe ensures an easy, comfortable, and exact distribution of the paste on your graphic card and CPU, among other things.
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YDuupxe 5Pcs CPU Thermal Paste White Adhesive with High Strength and Fast Bonding, Suitable for GPU IC Processor Consoles, Thermal Silicone Grease Silicone Glue for Cooling, LEDs, Heat
5PCS SET 5 TUBES OF SILICONE GREASE FOR LONG-TERM USE, WITH STRONG ADHESION PROPERTIES AND TOTAL 25G FOR MULTIPLE APPLICATIONS.
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2PCS Thermal Paste for CPU,CPU Paste Thermal,High-Performance Thermal Plaster,Heatsink Paste for IC/CPU/All Coolers,Thermal Grease with High Thermal Conductivity,Thermal Compound Paste Heatsink(3g)
2PCS THERMAL PASTE FOR CPU By using the thermal paste of the CPU in the piston design, our cpu paste thermal can provide a longer shelf life. You can also store high-performance thermal plaster very conveniently and won't cause you any trouble. Our heatsink paste for ic cpu all coolers are a cost-effective option with sustainable properties
Thermalright TF4 4g Thermal Compound Paste for Coolers, Heat Sink Paste High Durability 9.5W/m.k-4 Grams,Graphic Card CPU Thermal Grease, Laptop Thermal Grease(TF4 4g)
Easy to apply The needle-type designs is convenient for application and storage. the paste is not stiff and comes with a spatula, the moderate viscosity can be easily applied for a Homogeneous thin layer, so that all beginners can easily apply it.
