NM-C861 Mainboard,compatible For Lenovo IdeaPad 3-15ARE05 3-14ARE05 3-17ARE05, Laptop Motherboard With R3 R5 R7 AMD CPU(3-15ARE R3-4300U)

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  • Heat dissipation structure Areas with dense components need to be reasonably designed to reduce the impact of high temperatures on performance and extend service life.
  • Power stability Regarding operational reliability, high-load scenarios require sufficient power support to avoid performance fluctuations or operational interruptions.
  • Interface richness Including commonly used data interfaces, video interfaces, etc., it is necessary to meet the connection needs of external devices and improve the convenience of use.
  • Hardware compatibility It needs to match components such as processors and memory to ensure that each component works together to achieve overall performance.

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