BSFF Thermal Paste, 3.5g with Toolkit CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

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Product description

  • HIGH DURABILITY BS-139 thermal paste Edition formula has excellent component heat dissipation performance and has the stability to push the system to the limit.
  • BETTER THAN LIQUID METAL It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU GPU is dissipated quickly & efficiently.
  • EXCELLENT PERFORMANCE In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years.
  • EASY TO APPLY BS-139 thermal paste has ideal consistency and is very easy to use even for beginners

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